March 9 - 12, 2026
2 Page Abstract Submission Deadline: October 1, 2025
Call for
Papers
Topics and applications related to thermal design:
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Thermal technologies for advanced semiconductor packaging
(2.5D, 3D, HI) and microelectronics
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Advanced cooling for data centers and power electronics
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New thermal challenges in AI, 5G/6G and Edge hardware
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Energy efficiency and sustainability in thermal design
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Two-phase cooling innovations, passive and pumped
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Thermal design for aerospace, EVs, and ruggedized systems
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Advanced thermal materials & fabrication techniques
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Thermal measurement techniques and metrology
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CFD and multiphysics simulation.
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Machine learning in thermal analysis
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Reliability and thermal mechanical modeling
Technical Presentation Requirements
General
Presentations should summarize the design, tests, and findings of research and development efforts. Topics may include any thermally related challenge or solution from the die to the facility level.
When submitting your paper to SEMI-THERM, please indicate which contribution format you are submitting: a peer-reviewed manuscript, a non-peer reviewed extended abstract, presentation-only extended abstract, or poster session. See details below.
Requirements
For a paper to be included in the IEEE Xplore database and the SEMI-THERM Technical Library, and for the paper to be presented during
SEMI-THERM, all of the following conditions must be met:
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The final manuscript, with required reviewer edits, must be submitted to ARMS by the deadline stated above.
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At least one author must be registered to attend SEMI-THERM by the deadline stated above.
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The paper must be presented at SEMI-THERM by one of the paper’s authors.
Event Schedule
Presentations are generally scheduled between 8am – 12:30pm on Tuesday, Wednesday, and Thursday during the event. Each presentation is scheduled for a total of 20 minutes.
Typically, this includes 15 minutes of presentation and 5 minutes of Q&A. designed to summarize the design, tests, and findings of research and development efforts. Topics may include any thermally related challenge or solution from the die to the facility level.
Types of Presentations
Peer Reviewed Paper
Authors wishing to present a peer-reviewed paper must submit a completed manuscript and include all elements of a formal technical paper (introduction, an analysis, discussion of results, conclusions references). As part of the peer review process, SEMI-THERM reviewers may provide feedback on the paper and make suggestions for improving its quality.
Non-Peer-Reviewed Paper
Submit an extended abstract (2-5 pages) that describes the scope, contents, key results, findings and conclusions. Authors notified of acceptance in November. Final manuscript due in January. Manuscripts will be provided to conference attendees.
Presentation Only
Submit an extended abstract (2 -5 pages) that describes the scope, contents, key results, findings and conclusions. Authors notified of acceptance in November. Final presentation slides are due in March. Presentations will be provided to conference attendees. Presentation Only submissions are not eligible for the Best Paper award or student scholarship awards.