SEMI-THERM PRESENTATION TOPICS

Thermal Technologies for Advanced Semiconductor Packaging

Focus on cooling solutions for 2.5D and 3D integration, chiplet-based architectures, and advanced interposer technologies. This includes high-resolution thermal modeling of stacked die, thermally-aware package co-design, use of microfluidics and embedded cooling, and novel material integration for thermal spreading in advanced packages such as FOWLP, CoWoS, and EMIB. Emphasis on vertical thermal path optimization and stress modeling under power cycling conditions.

 

Advanced Cooling for Data Centers and Power Electronics

Explore liquid and two-phase cooling at rack, board, or chip scale. Topics include direct-to-chip cold plates, immersion cooling (single-phase and two-phase), warm water cooling, and novel coolant formulations. Also welcome: advanced thermal design for IGBT modules, GaN/SiC power electronics, and server-grade voltage regulators. Includes system-level thermal-energy optimization strategies, heat exchanger design, thermal bottleneck identification, and compliance with ASHRAE classes.

 

New Thermal Challenges in AI, 5G/6G, and Edge Hardware

As AI accelerators, edge devices, and high-frequency wireless systems grow in power density, submissions should explore cooling at the chiplet, interconnect, or enclosure level. Includes neural processor cooling, RF amplifier dissipation, and compact multi-die solutions in constrained form factors. Thermal mitigation techniques for non-uniform power profiles, transient workloads, and location-aware adaptive cooling are highly encouraged.

 

Energy Efficiency and Sustainability in Thermal Design

Focus on low-carbon-footprint thermal systems, use of recyclable materials, lifecycle-based thermal optimization, and system-level energy balance. Includes refrigerant GWP comparisons, use of passive or hybrid cooling to reduce parasitic load, and life-extension of electronics through thermally-aware power management. Papers may also address energy reuse (e.g., heat harvesting from servers), or compliance with sustainability standards such as Energy Star, LEED, or DoD mandates.

 

Two-Phase Cooling Innovations: Passive and Pumped

Covers novel designs and applications of heat pipes, vapor chambers, loop heat pipes, oscillating heat pipes, and mechanically pumped two-phase loops. Emphasis on thermal limits (capillary, sonic, viscous, entrainment), startup behavior, orientation independence, and performance under dynamic loads. Applications include aerospace (vacuum, microgravity), high-power electronics, and compact consumer systems. Novel wick structures, fluid compatibility, and integration with PCBs or enclosures are welcome.

 

Thermal Design for Aerospace, EVs, and Ruggedized Systems

Papers should address thermal management in systems exposed to extreme temperatures, shock, vibration, and wide altitude ranges. Includes conformal cooling in EV battery packs, avionics cold plate networks, and thermally-constrained enclosures for defense applications. Topics may include MIL-STD-810H compliance, SWaP-C trade-offs, vibration-damped thermal interfaces, and strategies for thermal management in variable-gravity or orbital environments.

 

Advanced Thermal Materials and Fabrication Techniques

Topics include thermally conductive polymers, nanostructured TIMs, composite baseplates, vapor chamber spreads with embedded features, and 3D-printed thermal structures. Submit work on material characterization (e.g., k, CTE, reliability), thermal barrier coatings, or integration of multifunctional materials (e.g., EMI shielding + thermal). Includes materials for wide bandgap devices, space-rated electronics, and high heat flux environments.

 

Thermal Measurement Techniques and Metrology

Covers experimental techniques for measuring temperature, heat flux, thermal conductivity, and interface resistance. Includes transient thermal testers, IR and micro-Raman thermography, laser flash, and time-domain thermoreflectance (TDTR). Novel test fixtures, miniaturized sensors, calibration methods, and measurement uncertainty analysis are encouraged. Application examples include packaged devices, microelectronics, and large-format systems.

 

CFD and Multiphysics Simulation

Papers should present advances in numerical modeling of thermal, fluid, and structural behavior. Topics include meshing strategies, turbulent flow in compact geometries, electro-thermal coupling, and thermal-mechanical fatigue simulation. Submissions leveraging AI-assisted solvers, GPU-based simulation acceleration, or integration with digital twins and real-time design loops are particularly encouraged.

 

Machine Learning in Thermal Analysis

Explore ML-driven approaches for thermal prediction, surrogate modeling, inverse design, and pattern detection in complex datasets. Use cases may include predictive maintenance, anomaly detection, automated optimization, and training models from experimental or simulated data. Applications to embedded systems, adaptive cooling control, and reliability forecasting are welcome.

 

Reliability and Thermo-Mechanical Modeling

Topics include fatigue under thermal cycling, warpage modeling, delamination, creep, and solder joint failure in high-power or high-density assemblies. Includes predictive modeling under JEDEC or MIL standards, accelerated aging, and failure mitigation strategies. Also covers system-level derating strategies, FEM modeling of stress under thermal load, and reliability trade-offs in thermal-mechanical co-design.