Mark Schultz received his B.S. in Engineering from Harvey Mudd College and M.S and PhD in Electrical and Computer Engineering from Carnegie Mellon University. He is currently a Senior Research Scientist at IBM's TJ Watson Research Center. His research interests include data storage systems, computer system packaging, and computer system cooling, with his inventions having been used across a wide range of IBM products. He holds 110+ US patents in these and related fields and has authored 40+ published technical papers. He led the experimental portion of IBM’s DARPA ICEcool program and now leads the cold plate portion of IBM’s ARPA-E CoolerCHIPS program and the IBM Research portion of IBM’s System Z cold plate R&D.