General Chair:
Herman Chu, Cisco Systems hchu@cisco.com

Program Chair:
Zeki Celik, LSI Corporation zeki.celik@lsi.com

Vice Program Chair:
Genevieve Martin, Philips Research genevieve.martin@philips.com

International Liaisons:
Clemens Lasance, Thermal Management Consultant P: +31 40 2841357 lasance@onsnet.nu
John Parry, Mentor Graphics Corp. P: +44 208 4873108 john.parry@mentor.com

Symposium Management:
Bonnie Crystal, CS Communications P: +1 480 839-8988 F: +1-480-345-1119 cscomm@earthlink.net

Exhibits Management:
Tom Tarter, SEMI-THERM Exhibits P: +1 408 969-2388 F: +1 408 841-7597 ttarter@semi-therm.org

Webmaster:
Clark Brown, Clark Brown Creative P: +1 580 574-8816 clark@clarkbrowncreative.com

Proceedings:
Paul Wesling, IEEE Publications P: +1 408 331-0114 F: +1 408 904-6997 p.wesling@ieee.org

Bernie Siegal, Chair
Clemens Lasance, Vice Chair
Jim Wilson, Finance Chair
Ross Wilcoxon, Technical Chair
David Copeland, Technical Editor
Bill Maltz, Membership Chair
George Meyer, Marketing Chair
Jay Nigen, Secretary
Dave Saums, Technical Advisor
Bruce Guenin, Techincal Advisor
Peter Raad, Technical Advisor
Dereje Agonafer, Technical Advisor

Operations Subcommittee:
Bernie Siegal, Chair, Thermal Engineering Associates bsiegal@thermengr.com

Marketing Subcommittee:
George Meyer, Celsia Technologies gmeyer@celsiatechnologies.com

Membership Subcommittee:
Bill Maltz, Electronic Cooling Solutions wmaltz@ecooling.com

Financial/Business Subcommittee:
Jim Wilson, Raytheon jsw@raytheon.com

Technical Subcommittee:
Ross Wilcoxon, Rockwell Collins, Inc. P: +1-319-295-7139 F: +1-319-295-3751 rwilcox@rockwellcollins.com