Short Course #2: TSV and Other Key Enabling Technologies for 3D IC/MEMS/LED Integration
Sunday, March 17, 2013
Dr. John H. Lau, Electronics & Optoelectronics Research Laboratory, Industrial Technology Research Institute (ITRI), Taiwan

3D IC integration is taking the electronics industry by storms. It has been: (a) impacting all segments of the semiconductors industry; (b) attracting the researchers and engineers to go to conferences and workshops; and (c) pushing the industry to build ecosystems. This is a perfect storm! People and companies think that Moore’s law is going to take a bow soon and 3D IC integration is the next one! In this one-day short course, TSVs (through-silicon vias) and other key enabling technologies such as thin-wafer handling, micro wafer bumping and assembly, and thermal management, and useful characterization and reliability data for of 3D IC integration will be discussed. The potential applications of 3D IC integration such as MEMS, LED, logic + logic, memory + microprocessor, wide I/O DRAM, active and passive interposers will also be presented.

These day long short courses will be held on the Sunday and Monday before the start of SEMI-THERM 29. The cost is $575 each.

Short Course #1: On-Chip and Embedded Cooling of High Flux Electronics
Monday, March 18, 2013
8:00 am – 5:00 pm
Dr. Avram Bar-Cohen, Distinguished University Professor, University of Maryland, USA

The continuing evolution of microelectronic logic and power conversion devices has led to high heat flux chips, along with local on-chip hot spots, and has made the application of aggressive on-chip thermal management a requisite part of any successful packaging strategy. The rapid proliferation of 3D chip stacks and 2.5D packaging form factors has further constrained the effectiveness of conventional "remote cooling" techniques and set the stage for the emergence of a new "embedded cooling" thermal packaging paradigm. This 1-day short course will focus on the characterization and remediation of near-junction temperature spikes in advanced electronic chips, including microprocessors, power amplifiers, triple junction solar cells, and LED's.

Short Course #3: Thermal Management of Electronic Systems
Sunday, March 17, 2013
Dr. Jeff Punch, Stokes Institute, University of Limerick, Limerick, Ireland

Thermal management has become a critical aspect in the design of contemporary electronic systems. Power dissipation levels have grown due to increased functionality and greater degrees of integration, and careful thermal design is imperative in order to meet today’s stringent requirements for reliability. The objective of this short course is to provide designers of electronic hardware with an introduction to the principles and practice of thermal management. A theoretical basis is used to establish useful design techniques, and these techniques are illustrated through examples and case studies.