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Wolverine Tube, Inc. Booth # 408
Wolverine Tube is a global company that has been in business for close to 100 years providing “innovative thermal solutions” to the automotive and HVAC industries with enhanced copper tube. The new MicroCool® Division has leveraged the company’s proprietary Micro Deformation tool technology to produce novel cold plates and integrated base plates for optimal liquid cooling solutions for the Electronics Industry.
Thermshield, LLC Booth # 502
Thermal management products for the electronics cooling market including heat sinks, skived and stack fin, heat pipe assemblies, extrusions, stampings, water-cooled plates, fans and other support equipment. Thermal design and design for low cost manufacturing is our specialty.
sp3 Diamond Technologies, Inc. Booth # 404
sp3 Diamond Technologies provides thin- and thick-film diamond products and deposition services to companies world-wide with a focus on DiaTherm™ heat spreaders for device thermal management and diamond-on-silicon applications for chip-level heat mitigation. The company also supplies Hot Filament CVD Diamond Deposition Reactors. sp3’s corporate headquarters and thin-film diamond deposition facility are located in Santa Clara, California. sp3’s thick-film facility, sp3 Ltd., is located in Calgary, Alberta, Canada.
Electronics Cooling Magazine Booth # 000
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. They have largely covered the most common materials and their associated thermal properties used in electronics packaging
Thermal Engineering Associates Booth # 101
TEA is a company founded by Bernie Siegal, a 35+-year veteran and recognized technical leader in the semiconductor thermal field. The company's mission is to provide a central source for the products and services necessary for proper semiconductor thermal measurement and modeling and solutions to attendant thermal management problems. Through its own products and services, augmented by an extensive network of technical experts around the world, TEA can assist customers in finding solutions. The Tech Briefs and Hot Links pages provide useful information to those interested in semiconductor and electronics thermal issues. We welcome the opportunity to discuss your thermally-related measurement, modeling and/or management requirements.
Staubli Corporation Booth # 202
Stäubli is a leading manufacturer of textile machinery, quick release couplings and robotics systems. With a workforce of over 3500 employees Stäubli is present in 25 countries supported by a comprehensive distribution network in 50 countries worldwide. Stäubli's North American headquarters is located in Duncan, South Carolina and has over 200 employees supporting Textile, Connectors and Robotics customers, with a dynamic sales force strategically placed from the East Coast to the West Coast, Canada and Mexico.
Software Cradle Co., Ltd. Booth # 000
Software Cradle Co. Ltd. (Osaka, Japan), a leading developer and service provider of CFD software, is delighted to exhibit award-winning CFD software designed for design engineers as well as CFD experts. Established in 1984, Software Cradle offers a suite of CFD products consisting of SC/Tetra (general purpose, unstructured mesh CFD), STREAM (general purpose, structured mesh CFD), HEAT Designer (structured mesh CFD specialized for electronics cooling) and CADthru (CAD to CFD geometry translation). Software Cradle products are distributed and supported worldwide by its offices in Japan and North America (Cradle North America, Dayton, OH), and distributors throughout Asia, North America and Europe. In this conference, Cradle will mainly exhibit HEAT Designer which is used by majority of Japanese electronics companies that are utilizing CFD in their design process. Its outstanding operationablity, fast and stable computation, ability to handle thousands of parts, flexibility and powerful postprocessor have been contributing to the innovation of Japanese electronics technologies. These traits enable users to import real CAD data and simulate as it is. Some of the users utilize 100 to 200 million meshes on windows platform. Please come and visit our booth or workshop to find out how HEAT Designer could maximize your work.
Shin-Etsu MicroSi Booth # 400
Shin-Etsu MicroSi- Inc.- together with our parent company Shin-Etsu Chemical Co.- Ltd. represent world-class leadership in the development and manufacture of specialty materials for the semiconductor industries. Our product lines are specifically designed to address today's photolithography- packaging and flexible printed circuit requirements.
Momentive Performance Materials Booth # 307
Momentive Performance Materials offers a family of thermal management products for today's high power electronics, ranging from PolarTherm* boron nitride powders to highly-conductive TPG* thermal pyrolytic graphite materials and composites. PolarTherm boron nitride powders offer a unique combination of thermal, electrical, and mechanical properties that make them excellent candidates for use in a range of thermal management materials, including gap fillers and underfills, potting and molding compounds, silicone and other compliant pads, liquid encapsulants, and compounded thermoplastics. Highly-conductive TPG thermal pyrolytic graphite materials and TC1050* thermal cores offer solutions for high performance heat spreading and dissipation requirements. These passive technologies, exhibiting thermal conductivities from 2.5 to 4 times that of copper, can provide unique solutions for high performance heat spreading and dissipation needs.
*PolarTherm, TPG, and TC1050 are trademarks of Momentive Performance Materials, Inc.
Microsanj Booth # 000
Microsanj is a leading provider of high-resolution transient thermal imaging services and solutions for both commercial and research applications. The system is based on optical thermoreflectance characterization; digital signal processing and advanced patented software algorithms that supports electronic and optoelectronic components measurement, thermal design validation of ICs, defects and failure analysis and biological samples.
Jenoptik Booth # 303
State-of-the-art Thermal Imaging Solutions: Thermographic camera systems of the VarioCAM® high resolution family and IR-TCM infrared camera modules by Jenoptik, a leading manufacturer, stand out for image quality, resolution, ergonomic handling and long-time reliability. Especially in electronics R&D and manufacturing processes, the innovative infrared imaging systems are essential tools for thermal design, thermal characterization testing, inspection and quality control of electronic components and systems. Product Highlights: + Spatial resolution up to 1.2 megapixel + Thermal resolution better than 70 mK + Long-time performance in terms of reproducibility and homogenity + Great variety of IR optics available (wide angle, tele, macro). The thermal camera systems and IR optics are developed and manufactured in Germany by ESW GmbH, a company of JENOPTIK I Defense & Civil Systems (www.jenoptik.com/dcs) and leading manufacturer of thermographic and thermal imaging systems. North America residents might want to contact our United States subsidary: JENOPTIK Optical Systems, Inc., 16490 Innovation Drive, Jupiter, FL 33478 USA.
Indium Corporation Booth # 201-203
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001.
Henkel Corporation Booth # 500
Henkel is the world’s leading supplier of advanced materials for next-generation electronics assembly and packaging applications. From wafer-level to board-level through to final assembly, Henkel’s world-renowned Hysol®, Loctite® and Multicore® product portfolios provide today’s electronics specialists with the proven, reliable and compatible material solutions they need to stay competitive.
Fujipoly America Corp. Booth # 200
Fujipoly is a global company with locations in North America, Europe, Japan, Thailand, Singapore, China and Hong Kong. Our thermal management materials range in performance to suit your application. We specialize in thin films, gold fillers, putty, paste and grease.
Dow Corning Corporation Booth # 000
Dow Corning Electronics - Offers a full line of Thermal Interface Materials backed by industry-leading global manufacturing, sales and application support. It’s easy to do business with Dow Corning. We understand your needs and bring new ideas to market. To learn more: www.dowcorning.com\electronics Contact: David Hirschi, Global Marketing Manager, david.hirschi@dowcorning.com.
Decagon Devices, Inc. Booth # 402
AOS Thermal Compounds Booth # 403
AOS Thermal Compounds is a manufacturer of dependable thermal management solutions, including thermal paste, heat sink compounds, and non-silicone grease. Common applications are found in micro-electronic, automotive, power generation and other performance-intensive markets. AOS Thermal Compounds is a leading innovator of dry-to-the touch thermal grease pads, that offer low thermal resistance without the mess of thermal grease. These products are not phase change material which offers cleaner and easier application.
Analysis Tech, Inc. Booth # 501
SEMICONDUCTOR COMPONENT THERMAL TESTERS for resistance, impedance, and die-attachment using electrical-junction temperature-measurement on any device type (transient and steady state); Thermal-lab test products for component thermal characterization and contract test services.
THERMAL INTERFACE MATERIAL TESTERS (TIM Testers) for thermal conductivity measurements of electronic-packaging interface-materials; test services also offered.
EVENT DETECTORS for solder joint and connector reliability testing.
ALPHA NOVATEC, INC. Booth # 301
Alpha Novatech, Inc. is your partner for Thermal Solutions. We offer a wide variety of standard heat sinks and accessories. Our product line includes natural convection, forced convection, and active heat sinks. We also offer various attachment methods and hardware for almost any application. In addition, we offer free heat sink thermal simulations
Advanced Cooling Technologies Booth # 304
Advanced Cooling Technologies Inc. develops innovative thermal technologies and provides technology-based thermal products to customers in the electronics, energy systems, aerospace, military and government sectors. ACT specializes in custom thermal product design and fabrication. Two-phase flow heat transfer, heat pipes and advanced thermal systems are particular areas of expertise.
AIM Specialty Materials Booth # 401
AIM offers specialty materials to fulfill the requirements of a broad range of applications. AIM Specailty Materials include indium, bismuth, and gold alloys available in many forms and configurations.
Alfatec GmbH & Co KG - Kerafol Booth # 000
Alfatec GmbH & CoKG - Kerafol is an European manufacturer and offers Keratherm® /Softtherm® flexible ceramic filled thermal interface materials. For managing component level heat transfer in electronic products. High performance at low mounting pressure for lowest thermal resistance are the key factors for all the products. All Gap Fillers are high compressible and do have memory effect. Also available are high performance thermal grease products as well as silicone free materials for medical or aero-space applications. Specially designed products are ferrite based types to absorb EMI and flexible printed circuits.
Mentor Graphics - Mechanical Analysis Division
Booth # 300/302
Long Win Science & Technology Corporation Booth # 000
Long Win specializes in research, design, manufacture and service of scientific instruments for thermal managing, material & fluid mechanic and educational fields, and they hold a leading position on research, measurement and inspection apparatus for the electronic cooling market. Some of their products include thermal-related measurement apparatus for fan performance, TIMs, cooler modules, heat pipes, vapor chambers, IC packages, LEDs, and natural-convection simulation. They have more than 100 types of equipment in
their 18,000 sq. ft. lab in Taiwan.
www.longwin.com
Gatekeeper Lab Private Ltd. Booth # 405
Based in Singapore, Gatekeeper Laboratories has developed a method to enhance vapor chamber performance by up to three times. Gatekeeper’s vapor chamber technology can be incorporated into various forms of air cooled heatsinks for different applications. Currently, Gatekeeper has built in its vapor chamber into custom CPU heatsinks for the high performance server/processor market.
Rathbun Associates Booth # 000
Rathbun Associates is a Select 3M Converter specializing in 3M Thermally Conductive Interface Material solutions. 3M solutions include Acrylic Thermal Pads, Silicone Thermal Pads, and High Adhesion Thermally Conductive Acrylic Transfer Tapes and Thermal Grease. Rathbun carries a large selection of Thermal Pads in-stock, ready to ship for JIT applications.
CPS Technologies Corporation Booth # 000
CPS Technologies Corporation is the worldwide leader in the design and high-volume production of AlSiC (aluminum silicon carbide) for high thermal conductivity and device compatible thermal expansion. AlSiC thermal management components manufactured by CPS include Hermetic electronic packages, Heat sinks, Microprocessor & Flip chip heat spreader lids, Thermal substrates, IGBT base plates, Cooler baseplates, Pin Fin baseplates for Hybrid Electric Vehicles (HEV), Microwave & Optoelectronic Housings and System in Package (SiP) Heat Spreader Lids that address multiple IC’s on a PCB with a single lid design.
Future Facilities Booth # 000
Future Facilities provides the 6SigmaDC suite of simulation-based software tools that support the “Virtual Facility” approach to data center design and operational management. The Virtual Facility is 3D mathematical model of the actual facility that is used to optimize space, power and cooling resource utilization throughout the data center lifespan. It also serves as a communication platform to enable collaboration between designers, operators, suppliers and hardware manufacturers. The Virtual Facility is the only approach that can solve the most pressing problem in data center operations: loading capacity that is lost to mismanagement of data center resources.