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| SEMI-THERM 26 Operating Committee | |||
|---|---|---|---|
| General Chair: | Attila Aranyosi
Electronic Cooling Solutions Inc. |
P: +1-408-396-5400 F: +1-408-738-8337 |
aaranyosi@ecooling.com |
| Program Chair: | Sai Ankireddi
Sun Microsystems Inc. |
P: +1-408-276-5849 | sai.ankireddi@alumni.purdue.edu |
| Vice Program Chair: | Herman Chu
Cisco Systems |
P: |
hchu@cisco.com |
| International
Liaisons: |
Europe
Clemens J.M. Lasance Consultant, Thermal Management John Parry Flomerics Ltd. Far East Professor Hsiao-Kang Ma National Taiwan University |
P: +31 40 2841357 P: +44-208-487-3108 .
P: +886-2-23629976
|
lasance@onsnet.nu . |
| Proceedings/
Registration: |
Bonnie Crystall
C/S Communications, Inc. |
P: +1-480-839-8988
F: +1-480-345-1119 |
cscomm@earthlink.net |
| Exhibitor
Booths: |
Tom Tarter
|
P: +1-408-505-0946
F: +1-408-841-7597 |
ttarter@semi-therm.org |
| Symposium
Management: |
Bonnie Crystall
C/S Communications, Inc. |
P: +1-480-839-8988
F: +1-480-345-1119 |
cscomm@earthlink.net |
| Webmaster; Past
Proceedings: |
Paul Wesling,
IEEE Publications Chair |
P: +1-408-331-0114
F: +1-408-904-6997 |
p.wesling@ieee.org |
| SEMI-THERM Steering Committee | |||
|---|---|---|---|
|
Bruce Guenin Clemens Lasance, Vice Chair Jim Wilson, Financial/Business Chair Ross Wilcoxon, Technical Chair Bernie Siegal, Chair; Operations Chair David Copeland, Technical Editor |
Bill Maltz, Membership Chair John Parry, Marketing Chair Paul Hundt Dave Saums Jay Nigen, Secratary |
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| Operations Subcommittee: | Bernie Siegal, Chair
Thermal Engineering Assoc. |
P: +1-650-961-5900 F: +1-650-323-9237 |
b.siegal@ieee.org |
| Marketing Subcommittee: | John Parry, Chair
|
P: F: |
john.parry@flomerics.co.uk |
| Membership Subcommittee: | Bill Maltz, Chair
|
P: F: |
wmaltz@ecooling.com |
| Financial/Business Subcommittee: | Jim Wilson, Chair
Raytheon |
P: F: |
jsw@raytheon.com |
| Technical Subcommittee: | Ross Wilcoxon, Chair
Rockwell Collins, Inc. |
P: +1-319-295-7139 F: +1-319-295-3751 |
rkwilcox@rockwellcollins.com |